Industry News

CSME's annual summit at Purdue to bolster semiconductor security

Sept. 22, 2023

Center for Secure Microelectronics Ecosystem event will include industry representatives and feature more than 30 student research presentations

Mike Bacidore

Semiconductor chips require a level of security that protects them in everything from automobiles and cellphones to artificial intelligence and machine learning.

The Center for Secure Microelectronics Ecosystem (CSME) at Purdue is tackling these challenges by working to develop advances to protect microelectronics and semiconductors. The center will hold its annual meeting September 26-27 in West Lafayette, Indiana, with university partners and industry sponsors, highlighting the research that connects the multi-institutional academic community with semiconductor industry leaders and the U.S. Department of Defense to safeguard economic and national security interests.

This year’s annual summit will have a number of industry representatives in attendance and feature more than 30 student research presentations and posters.

The event's tentative agenda includes presentations on:

• a CAD framework for quantifiable assurance of third-party hardware IP

• device age estimation using intrinsic odometers

• advanced circuit techniques for side-channel-attack countermeasures

• environmental characterization of magnetic random access memory

• machine learning for side-channel detection

• detecting side-channel leakage through adversarial training of deep neural networks.

Figure 1: The 2023 CSME meeting will build on the results of the 2022 meeting at the Convergence Center in West Lafayette, Indiana.

Semiconductor-technology advancements have driven progress in computing, communication, information and data processing, as well as energy generation and distribution. The technology is one of the essential industries for the global economy and security. Ensuring the ecosystem’s security is critical. In the global market, CSME fosters the collaboration between industry, academia and the U.S. government with the aim to ensure a secure supply of materials, semiconductor chips and related tools all the way from the foundry to the packaged system assuming a zero-trusted model (Figure 1).

About the Author

Mike Bacidore | Editor in Chief

Mike Bacidore is chief editor of Control Design and has been an integral part of the Endeavor Business Media editorial team since 2007. Previously, he was editorial director at Hughes Communications and a portfolio manager of the human resources and labor law areas at Wolters Kluwer. Bacidore holds a BA from the University of Illinois and an MBA from Lake Forest Graduate School of Management. He is an award-winning columnist, earning multiple regional and national awards from the American Society of Business Publication Editors. He may be reached at [email protected]