Molex, a global electronics and connectivity provider, acquired core technology and intellectual property (IP) from Keyssa Inc., a manufacturer of high-speed contactless connectors. The acquisition of this wireless chip-to-chip technology, including more than 350 filed patent applications, is expected to Molex’s strategy to expand and diversify its micro connector portfolio with flexible, cable-free connectors for near-field, device-to-device applications.
“Keyssa’s wireless chip-to-chip technology complements Molex’s developments in mmWave antenna connectivity to meet the growing demands for high data rate transmissions,” said Justin Kerr, vice president and general manager, Micro Solutions Business Unit, Molex. “We constantly push the technology envelope for our mobile and consumer device customers, offering greater product design freedom while supporting next-generation wireless connectivity needs.”
The acquired technology operates at data rates as fast as 6 Gbps on the 60 GHz band with no WiFi or Bluetooth interference. The small, low-power, low-latency, solid-state contactless connectors can solve critical data transmission needs with minimal overhead. Molex plans to advance these current capabilities by supporting higher data rates and full-duplex communications. Additionally, Molex will leverage its signal integrity expertise and mmWave antenna capabilities to speed the commercialization of new contactless connectors while complementing its existing portfolio of products.
Molex also will take advantage of the Virtual Pipe I/O (VPIO) technology Keyssa developed to resolve protocol inefficiencies. By aggregating low- and high-speed protocols for simultaneous transmission over one or more links, VPIO can help compensate for real-time events that impact link performance integrity
Molex is also ramping a team of more than 25 engineers in the United States and India to develop products based on this technology. Initially, the focus will be on the connectivity needs of high-volume mobile applications where contactless connectors offer potential benefits in design for manufacturing, serviceability, reliability, signal aggregation and security. Over time, Molex will apply this technology to address emerging application areas, encompassing smart factories, automotive advanced safety, medical robotics and more.
“Molex has a longstanding commitment to invest in world-class solutions that not only solve current problems for leading mobile and consumer device manufacturers, but also anticipate their future challenges,” said Eric VanAlstyne, director, corporate development, Molex. “The decision to acquire Keyssa’s technology and IP strengthens our position as a supplier of choice with innovations in both mechanical and contactless connectivity.”
