The industrial case system (ICS) family includes 50-mm enclosures with passive heatsinks, making them suitable for thermally demanding applications. The company is offering online thermal simulations to help engineers optimize their printed circuit board (PCB) layouts for proper heat dissipation and also providing a way to identify potential long-term failures at an early stage so preventive steps can be taken. The ICS 50 can accommodate as many as four PCBs, making it suitable for I/O groups and other advanced automation applications. The aluminum design improves the removal of thermal power dissipation from inside the device. It is available in 100 mm and 122 mm heights.
