Autodesk, Siemens sign agreement to increase software interoperability

March 3, 2016
Both companies will share toolkit technology and exchange end-user software applications to build and market interoperable products.

Autodesk, Inc. and Siemens have announced an interoperability agreement aimed at helping manufacturers decrease the costs associated with incompatibility among product development software applications and avoid potential data integrity problems.

Through this agreement, Autodesk and Siemens’ product lifecycle management (PLM) software business will take steps to significantly improve the interoperability between their companies’ respective software offerings.  

According to Siemens, today's manufacturers are under increased pressure to get high quality products to market faster, with increased efficiencies and lower costs to the consumer. Many of these companies operate in environments consisting of various solutions from different CAD software vendors. These multi-CAD environments may exist internally between departments or externally with partners and supply chains. Interoperability among CAD software has therefore emerged as a critical issue for users of design and engineering software, and achieving it is a major challenge for manufacturers.

The Siemens/Autodesk interoperability agreement aims to decrease the overall effort and costs that are commonly associated with supporting these environments. Under the terms of the agreement, both companies will share toolkit technology and exchange end-user software applications to build and market interoperable products.

“Interoperability is a major challenge for customers across the manufacturing industry, and Autodesk has been working diligently to create an increasingly open environment throughout our technology platforms,” said Lisa Campbell, vice president of Manufacturing Strategy and Marketing at Autodesk. “We understand that our customers use a mix of products in their workflow and providing them with the flexibility they need to get their jobs done is our top priority.”

Sponsored Recommendations

2024 State of Technology Report: Packaging Equipment

Special considerations and requirements make packaging equipment an interesting vertical market unto itself. This new State of Technology Report from the editors of ...

High Sensitivity Accelerometers to Monitor Traffic and Railroad Vibration for Semiconductor Manufacturing

This paper examines highly sensitive piezoelectric sensors for precise vibration measurement which is critical in semiconductor production to prevent quality and yield issues....

Simulation for Automation Guide

How digital twin solutions are expanding the capabilities of plant engineers.

Enhancing HMI Security and Accessibility with Cloud VPN Solutions

Enhance HMI security and remote access with Beijer’s cloud VPN solution. Enjoy advanced encryption, easy setup, and secure access via laptops, smartphones, or tablets. Cut costs...