Lee Pochter, CEO, Qosina

Qosina names Lee Pochter as CEO

Nov. 27, 2024
Scott Herskovitz prunes his role to president and board chair at component distributor

Qosina, componente distributor specializing in medical devices, has promoted Executive Vice President Lee Pochter to the position of chief executive officer.

“Lee has been an integral part of the Qosina team and has consistently demonstrated exceptional leadership, a deep understanding of our values and a commitment to our mission,” said Scott Herskovitz, president and chairperson of the board.

“I am truly honored to step into the role of CEO at Qosina,” said Pochter. “Qosina’s unwavering commitment to innovation, quality and customer success inspires me every day. I am excited to lead our talented team as we embark on this next chapter, building on the strong foundation laid by Scott Herskovitz and continuing to drive growth, excellence and meaningful impact for our customers and partners worldwide.”

Herskovitz, formerly president, CEO and chairperson of the board, has transitioned into the role of president and chairperson of the board. In this new capacity, Herskovitz will provide leadership and guidance while focusing on advancing Qosina's strategic goals. As president, Herskovitz will engage with customers, partners and stakeholders, ensuring the company’s ongoing alignment with industry trends and fostering business development opportunities.

Since 1980, Qosina has partnered with medical device engineers, providing thousands of in-stock components. With offices in the United States and Europe, Qosina offers global reach with localized service. Qosina’s product portfolio includes over 5,000 components across more than 25 categories. Qosina has an ISO 8 Class 100,000 cleanroom for repackaging.

Sponsored Recommendations

2024 State of Technology Report: PLCs and PACs

Programmable logic controllers (PLCs) and programmable automation controllers (PACs) are the brains of the machine in many regards. They have evolved over the years.This new State...

2024 State of Technology Report: Packaging Equipment

Special considerations and requirements make packaging equipment an interesting vertical market unto itself. This new State of Technology Report from the editors of ...

High Sensitivity Accelerometers to Monitor Traffic and Railroad Vibration for Semiconductor Manufacturing

This paper examines highly sensitive piezoelectric sensors for precise vibration measurement which is critical in semiconductor production to prevent quality and yield issues....

Simulation for Automation Guide

How digital twin solutions are expanding the capabilities of plant engineers.